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Semiconductor Process Reliability in Practice

2 in stock

Firm sale: non returnable item
SKU 9780071754279 Categories ,
Select Guide Rating
Filled with practical examples, this is a comprehensive reference on process reliability for semiconductor process and design engineers.

Publisher''s Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, <span style="...

£147.99

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Description

Product ID:9780071754279
Product Form:Hardback
Country of Manufacture:US
Title:Semiconductor Process Reliability in Practice
Authors:Author: Juin Liou, Zhenghao Gan, Waisum Wong
Page Count:624
Subjects:Communications engineering / telecommunications, Communications engineering / telecommunications
Description:Select Guide Rating
Filled with practical examples, this is a comprehensive reference on process reliability for semiconductor process and design engineers.

Publisher''s Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.


Proven processes for ensuring semiconductor device reliability

Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.

Coverage includes:

  • Basic device physics
  • Process flow for MOS manufacturing
  • Measurements useful for device reliability characterization
  • Hot carrier injection
  • Gate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)
  • Negative bias temperature instability
  • Plasma-induced damage
  • Electrostatic discharge protection of integrated circuits
  • Electromigration
  • Stress migration
  • Intermetal dielectric breakdown


Imprint Name:McGraw-Hill Professional
Publisher Name:McGraw-Hill Education - Europe
Country of Publication:GB
Publishing Date:2012-11-16